* 바카라 배팅 법/eSSC SEMINAR *

normal바카라 배팅 법 style=mso-bidi-font-weight:normalPackaging of High Power LEDsline-height:200%

mso-fareast-language:KO

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Speaker : 신무환 박사[style=font-size:12pt; line-height:200%;Semiconductor 바카라 배팅 법 Design
Lab]

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Location : 물리학과 세미나실 (공학3동 201호)

》》Date
& Time : 1월 24일(수) 오후 15:30 ~ 17:00

lang=EN-USElang=EN-US style=font-size:12pt;ffective 바카라 배팅 법 management in high power LEDs is still one of
critical issues for the realization of the devices for general illumination and
other applications which require high power operation. A great portion, more
than 80 %, of the drive input power to operate GaN-based LEDs is consumed in
generating phonons rather than photons. In this paperstyle=font-size:12pt; mso-fareast-font-family:바탕;mso-fareast-language:KO,lang=EN-US style=font-size:12pt; 바카라 배팅 법 packaging schemes바탕;mso-fareast-language:KO will be discussedlang=EN-US style=font-size:12pt; from the
package level to system level. In particular, style=font-size:12pt; mso-fareast-font-family:바탕;mso-fareast-language:KOceramic packages
with different paths of 바카라 배팅 법 dissipation were designed by using 바카라 배팅 법
simulator which utilizes finite volume method. It was shown that the 바카라 배팅 법
characteristics of the LED packages were strongly affected by the contact area
of 바카라 배팅 법 via in contact with LED chip rather than that in contact with the
ceramic mold. Multi-chip schemes are also analyzed for 바카라 배팅 법ly efficient LED
packaging design.